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74FST3257 Quad 2:1 Multiplexer/ Demultiplexer Bus Switch
The ON Semiconductor 74FST3257 is a quad 2:1, high performance multiplexer/demultiplexer bus switch. The device is CMOS TTL compatible when operating between 4 and 5.5 Volts. The device exhibits extremely low RON and adds nearly zero propagation delay. The device adds no noise or ground bounce to the system.
Features http://onsemi.com MARKING DIAGRAMS
16 FST3257G AWLYWW 1
* * * * * * * *
RON t 4 W Typical Less Than 0.25 ns-Max Delay Through Switch Nearly Zero Standby Current No Circuit Bounce Control Inputs are TTL/CMOS Compatible Pin-For-Pin Compatible With QS3257, FST3257, CBT3257 All Popular Packages: SOIC-16, TSSOP-16, QSOP-16 Pb-Free Packages are Available
16 1 SOIC-16 D SUFFIX CASE 751B
16 16 1 FST 3257 ALYW G G 1 16 S3257 ALYW
S 1B1 1B2 1A 2B1 2B2 2A GND
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10 9
VCC OE 4B1 4B2 4A 3B1 3B2 3A
TSSOP-16 DT SUFFIX CASE 948F
16 1
Figure 1. 16-Lead Pinout
QSOP-16 QS SUFFIX CASE 492 A WL, L Y WW, W G
1 = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package
S X L H
OE H L L
Function Disconnect A = B1 A = B2
Figure 2. Truth Table
(Note: Microdot may be in either location)
PIN NAMES
Pin OE1, OE2 S0, S1 A B1, B2, B3, B4 Description Bus Switch Enables Select Inputs Bus A Bus B
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2007
1
January, 2007 - Rev. 4
Publication Order Number: 74FST3257/D
74FST3257
1A
1B
1B2 2A
2B1
2B2 3A
3B1
3B2
4A
4B1 4B2
FLOW CONTROL
OE S
Figure 3. Logic Diagram
ORDERING INFORMATION
Device Order Number 74FST3257D 74FST3257DR2 74FST3257DR2G 74FST3257DT 74FST3257DTR2 74FST3257DTR2G 74FST3257QS 74FST3257QSR Package SOIC-16 SOIC-16 SOIC-16 (Pb-Free) TSSOP-16* TSSOP-16* TSSOP-16* QSOP-16 QSOP-16 Shipping 48 Units / Rail 2500 Units / Tape & Reel 2500 Units / Tape & Reel 96 Units / Rail 2500 Units / Tape & Reel 2500 Units / Tape & Reel 96 Units / Rail 2500 Units / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb-Free.
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74FST3257
MAXIMUM RATINGS
Symbol VCC VI VO IIK IOK IO ICC IGND TSTG TL TJ qJA DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Sink Current DC Supply Current per Supply Pin DC Ground Current per Ground Pin Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds Junction Temperature Under Bias Thermal Resistance SOIC TSSOP QSOP VI t GND VO t GND Parameter Value *0.5 to )7.0 *0.5 to )7.0 *0.5 to )7.0 *50 *50 128 $100 $100 *65 to )150 260 )150 125 170 200 Level 1 Oxygen Index: 28 to 34 Human Body Model (Note 1) Machine Model (Note 2) Charged Device Model (Note 3) Above VCC and Below GND at 85_C (Note 4) UL 94 V-0 @ 0.125 in u2000 u200 N/A $500 V Unit V V V mA mA mA mA mA _C _C _C _C/W
MSL FR VESD
Moisture Sensitivity Flammability Rating ESD Withstand Voltage
ILatchup
Latchup Performance
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Tested to EIA/JESD22-A114-A. 2. Tested to EIA/JESD22-A115-A. 3. Tested to JESD22-C101-A. 4. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol VCC VI VO TA Dt/DV Supply Voltage Input Voltage Output Voltage Operating Free-Air Temperature Input Transition Rise or Fall Rate Switch I/O Switch Control Input VCC = 5.0 V $ 0.5 V Parameter Operating, Data Retention Only (Note 5) (HIGH or LOW State) Min 4.0 0 0 *40 0 Max 5.5 5.5 5.5 )85 DC 5 Unit V V V _C ns/V
5. Unused control inputs may not be left open. All control inputs must be tied to a high or low logic input voltage level.
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74FST3257
DC ELECTRICAL CHARACTERISTICS
VCC Symbol VIK VIH VIL II IOZ RON Parameter Clamp Diode Resistance High-Level Input Voltage Low-Level Input Voltage Input Leakage Current Off-State Leakage Current Switch On Resistance (Note 6) 0 v VIN v 5.5 V 0 v A, B v VCC VIN = 0 V, IIN = 64 mA VIN = 0 V, IIN = 30 mA VIN = 2.4 V, IIN = 15 mA VIN = 2.4 V, IIN = 15 mA ICC DICC Quiescent Supply Current Increase In ICC per Input VIN = VCC or GND, IOUT = 0 One input at 3.4 V, Other inputs at VCC or GND Conditions IIN = *18mA (V) 4.5 4.0 to 5.5 4.0 to 5.5 5.5 5.5 4.5 4.5 4.5 4.0 5.5 5.5 4 4 8 11 2.0 0.8 $1.0 $1.0 7 7 15 20 3 2.5 mA mA TA = *40_C to )85_C Min Typ* Max *1.2 Unit V V V mA mA W
*Typical values are at VCC = 5.0 V and TA = 25_C. 6. Measured by the voltage drop between A and B pins at the indicated current through the switch. On resistance is determined by the lower of the voltages on the two (A or B) pins.
AC ELECTRICAL CHARACTERISTICS
TA = *40_C to )85_C CL = 50 pF, RU = RD = 500 W VCC = 4.5-5.5 V Symbol tPHL, tPLH tPZH, tPZL tPHZ, tPLZ Parameter Prop Delay Bus to Bus (Note 7) Prop Delay, Select to Bus A Output Enable Time, Select to Bus B Output Enable Time, IOE to Bus A, B Output Disable Time, Select to Bus B Output Disable Time, IOE to Bus A, B VI = 7 V for tPZL VI = OPEN for tPZH VI = 7 V for tPLZ VI = OPEN for tPHZ Conditions VI = OPEN 1.0 1.0 1.0 1.0 1.0 Min Max 0.25 4.7 5.2 5.1 5.2 5.5 VCC = 4.0 V Min Max 0.25 5.2 5.7 5.6 5.5 5.5 ns ns Unit ns
7. This parameter is guaranteed by design but is not tested. The bus switch contributes no propagation delay other than the RC delay of the typical On resistance of the switch and the 50 pF load capacitance, when driven by an ideal voltage source (zero output impedance).
CAPACITANCE (Note 8)
Symbol CIN CI/O CI/O Parameter Control Pin Input Capacitance A Port Input/Output Capacitance B Port Input/Output Capacitance VCC = 5.0 V VCC, OE = 5.0 V VCC, OE = 5.0 V Conditions Typ 3 7 5 Max Unit pF pF pF
8. TA = )25_C, f = 1 MHz, Capacitance is characterized but not tested.
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74FST3257
AC Loading and Waveforms
VI FROM OUTPUT UNDER TEST CL* 500 W
500 W
NOTES: 1. Input driven by 50 W source terminated in 50 W. 2. CL includes load and stray capacitance. *CL = 50 pF
Figure 4. AC Test Circuit
tf = 2.5 nS 90 % SWITCH INPUT 1.5 V 10 % tPLH 90 % 1.5 V
tf = 2.5 nS 3.0 V
10 % tPLH
GND VOH
1.5 V OUTPUT
1.5 V VOL
Figure 5. Propagation Delays
tf = 2.5 nS tf = 2.5 nS ENABLE INPUT 90 % 1.5 V 10 % tPZL OUTPUT 10 % 90 % 1.5 V GND tPZL 3.0 V
1.5 V
VOL + 0.3 V VOL tPHZL VOH
tPZH
1.5 V OUTPUT
VOH - 0.3 V
Figure 6. Enable/Disable Delays
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74FST3257
PACKAGE DIMENSIONS
SOIC-16 D SUFFIX CASE 751B-05 ISSUE K
-A-
16 9 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019
-B-
1 8
P
8 PL
0.25 (0.010)
M
B
S
G F
K C -T-
SEATING PLANE
R
X 45 _
M D
16 PL M
J
0.25 (0.010)
TB
S
A
S
SOLDERING FOOTPRINT
8X
6.40
16X
1.12 16
1
16X
0.58
1.27 PITCH 8 9
DIMENSIONS: MILLIMETERS
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74FST3257
PACKAGE DIMENSIONS
TSSOP-16 DT SUFFIX CASE 948F-01 ISSUE B
16X K REF
0.10 (0.004) 0.15 (0.006) T U
S
M
TU
S
V
S
K K1
2X
L/2
16
9
J1 B -U-
SECTION N-N J N
L
PIN 1 IDENT. 1 8
0.25 (0.010) M
0.15 (0.006) T U
S
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_
A -V-
N F DETAIL E -W-
DIM A B C D F G H J J1 K K1 L M
C 0.10 (0.004) -T- SEATING
PLANE
H D G
DETAIL E
SOLDERING FOOTPRINT
7.06 1
16X
0.36
16X
1.26
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EEE CCC EEE CCC
0.65 PITCH
DIMENSIONS: MILLIMETERS
74FST3257
PACKAGE DIMENSIONS
QSOP-16 QS SUFFIX CASE 492-01 ISSUE O
-A- R
Q
H x 45_ U
RAD. 0.013 X 0.005 DP. MAX
-B-
MOLD PIN MARK
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. THE BOTTOM PACKAGE SHALL BE BIGGER THAN THE TOP PACKAGE BY 4 MILS (NOTE: LEAD SIDE ONLY). BOTTOM PACKAGE DIMENSION SHALL FOLLOW THE DIMENSION STATED IN THIS DRAWING. 4. PLASTIC DIMENSIONS DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 6 MILS PER SIDE. 5. BOTTOM EJECTOR PIN WILL INCLUDE THE COUNTRY OF ORIGIN (COO) AND MOLD CAVITY I.D. INCHES DIM MIN MAX A 0.189 0.196 B 0.150 0.157 C 0.061 0.068 D 0.008 0.012 F 0.016 0.035 G 0.025 BSC H 0.008 0.018 J 0.0098 0.0075 K 0.004 0.010 L 0.230 0.244 M 0_ 8_ N 0_ 7_ P 0.007 0.011 Q 0.020 DIA R 0.025 0.035 U 0.025 0.035 V 0_ 8_ MILLIMETERS MIN MAX 4.80 4.98 3.81 3.99 1.55 1.73 0.20 0.31 0.41 0.89 0.64 BSC 0.20 0.46 0.249 0.191 0.10 0.25 5.84 6.20 0_ 8_ 0_ 7_ 0.18 0.28 0.51 DIA 0.64 0.89 0.64 0.89 0_ 8_
RAD. 0.005-0.010 TYP
L 0.25 (0.010)
M
G T P DETAIL E
C
K
V N 8 PL -T-
D 16 PL 0.25 (0.010)
M
SEATING PLANE
TB
S
A
S
J M
F DETAIL E
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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74FST3257/D

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